IEC 60749-15 Ed. 1.0 标准详情
- 标准号:IEC 60749-15 Ed. 1.0
- 中文标题:
- 英文标题:Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
- 标准类别:国际电工委员会IEC
- 发布日期:
Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a solderin
* 特别声明:资源收集自网络或用户上传,本网站所提供的电子文本仅供参考,请以正式出版物为准。仅供个人标准化学习,研究使用。如有侵权,请及时联系我们!