ASTM F692-1997(2002) 标准详情
- 标准号:ASTM F692-1997(2002)
- 中文标题:测量可焊膜与基片的粘结强度的方法
- 英文标题:Standard Test Method for Measuring Adhesion Strength of Solderable Films to Substrates
- 标准类别:美国材料与试验协会ASTM
- 发布日期:1997
Failure of hybrid microcircuits is often due to failure of a solder bond. The limiting strength that can be obtained for a solder bond is often the adhesion of the soldered film to the substrate. This test method can be used for material selection, p
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