EIA 540GA00-1993 标准详情
- 标准号:EIA 540GA00-1993
- 中文标题:空白详细规范烧伤在插座芯片载体封装模压载体环的使用在电子设备
- 英文标题:Blank Detail Specification For Burn In Sockets For Chip Carrier Packages With Molded Carrier Rings For Use In Electronic Equipment
- 标准类别:美国电子工业协会EIA
- 发布日期:
The object of this specification is to provide all information required for the identification and quality assessment of the Burn In Sockets for Chip Carrier Packages with Molded Carrier Rings.
* 特别声明:资源收集自网络或用户上传,本网站所提供的电子文本仅供参考,请以正式出版物为准。仅供个人标准化学习,研究使用。如有侵权,请及时联系我们!