UNE EN 60749-14-2004 标准详情
- 标准号:UNE EN 60749-14-2004
- 中文标题:
- 英文标题:Semiconductor Devices - Mechanical And Climatic Test Methods - Part 14: Robustness Of Terminations (lead Integrity)
- 标准类别:西班牙国家标准UNE
- 发布日期:
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices
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