DIN IEC 60191-6-19 (2008-03) 标准详情
- 标准号:DIN IEC 60191-6-19 (2008-03)
- 中文标题:
- 英文标题:Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage (IEC 47D/709/CD:2007)
- 标准类别:德国标准DIN
- 发布日期: