IEC 61191-3 Ed. 1.0 标准详情
- 标准号:IEC 61191-3 Ed. 1.0
- 中文标题:
- 英文标题:Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
- 标准类别:国际电工委员会IEC
- 发布日期:
Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technol
* 特别声明:资源收集自网络或用户上传,本网站所提供的电子文本仅供参考,请以正式出版物为准。仅供个人标准化学习,研究使用。如有侵权,请及时联系我们!