IEC/PAS 62137-3-2008 标准详情
- 标准号:IEC/PAS 62137-3-2008
- 中文标题:电子组装技术.焊缝用环境和耐久性试验方法的选择指南
- 英文标题:Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints
- 标准类别:国际电工委员会标准
- 发布日期:2008-11
This guidance describes the selection of an appropriate test method for reliability test of solderjoints for various shapes and types of surface mount devices (SMD) and leaded devices,including various types of solder material.The regions of the join
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