I.S. EN 60749-20-1-2009
I.S. EN 60749-20-1-2009 标准详情
- 标准号:I.S. EN 60749-20-1-2009
- 中文标题:
- 英文标题:Semiconductor Devices - Mechanical and Climatic Test Methods - Part 20-1: Handling, Packing, Labelling and Shipping of Surface-mount Devices Sensitive to the Combined Effect of Moisture and Soldering Heat
- 标准类别:爱尔兰国家标准I.S.
- 发布日期:
内容简介
Pertains to all non-hermetic SMD packages which are subjected to reflow solder processes and which are exposed to the ambient air.
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