IEC 60749-20 Ed. 1.0 Cor.1 标准详情
- 标准号:IEC 60749-20 Ed. 1.0 Cor.1
- 中文标题:
- 英文标题:Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
- 标准类别:国际电工委员会IEC
- 发布日期: