I.S. EN 62137-4-2014 标准详情
- 标准号:I.S. EN 62137-4-2014
- 中文标题:
- 英文标题:Electronics Assembly Technology - Part 4: Endurance Test Methods for Solder Joint of Area Array Type Package Surface Mount Devices
- 标准类别:爱尔兰国家标准I.S.
- 发布日期:
Defines the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo-mechanical stress.
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