UNE EN 60191-6-2-2003
UNE EN 60191-6-2-2003 标准详情
- 标准号:UNE EN 60191-6-2-2003
- 中文标题:
- 英文标题:Mechanical Standardization Of Semiconductor Devices - Part 6-2: General Rules For The Preparation Of Outline Drawings Of Surface Mounted Semiconductor Device Packages - Design Guide For 1,50 Mm, 1,27 Mm And 1,00 Mm Pitch Ball And Column Terminal Pack
- 标准类别:西班牙国家标准UNE
- 发布日期:
内容简介
Gives the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as co
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